Asrock h310m-dgs.About this item

 

Asrock h310m-dgs

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Special offers and product promotions.UserBenchmark: Asrock HM-DGS Compatible Builds

 

ASRock Super Alloy; Supports 7th and 6th Generation Intel Core™ Processors (Socket ) * 8th Gen Intel Core™ desktop processors are supported with Intel Series chipset motherboards only; Supports DDR4 ; 1 PCIe x16, 1 PCIe x1; Graphics Output Options: DVI-D; CH HD Audio (Realtek ALC Audio Codec), ELNA Audio Caps; 4 . HM-DGS. Suporta Processadores Intel ® Core™ de 8ª e 9ª Geração (Socket ) Suporta DDR4 1 PCIe x16, 1 PCIe x1. Opções de Saída de Vídeo: DVI-D. Áudio HD Canais (Codec de Áudio Realtek ALC), Capacitores de Áudio ELNA. 4 SATA3. Popular components in PC builds with the Asrock HM-DGS Motherboard. CPU. Core i Intel $ Bench 76%, 93, samples. 36x. Core i Intel $ Bench 84%, , samples. 23x. Core i Intel $ Bench 89%, , samples. 22x. Core i Intel $ Bench 86%, 30, samples.

 

Asrock h310m-dgs.ASRock > HM-DGS

HM-DGS. Supports 9 th and 8 th Gen Intel ® Core™ Processors (Socket ) 1 PCIe x16, 1 PCIe x1. CH HD Audio (Realtek ALC Audio Codec), ELNA Audio Caps. Supports Full Spike Protection, ASRock Live Update & APP Shop. Mẫu sản phẩm này có thể không được bán toàn cầu. HM-DGS. Prise en charge des processeurs Intel ® Core™de 9ème et 8ème génération (Socket ) Supporte DDR4 1 PCIe x16, 1 PCIe x1. Sorties graphiques disponibles: DVI-D. l’audio CH HD (Codec l’audio . ASRock > HM-DGS 우리는 더 개인화되고 더 부드러운 경험을 제공하기 위해 쿠키를 사용합니다. 이 웹사이트를 방문하면 쿠키 사용에 동의하는 것 입니다. 쿠키를 허용하지 않거나 추가 정보가 필요한 경우 당사의 개인 정보 보호 정책 을 방문하십시오.
 
 
related:

Customers also viewed these products
ASROCK HM HDV Motherboard |

IBM Improves the Semiconductor Manufacturing Process

IBM plans to introduce improvements to its semiconductor chip manufacturing process, which it claims will allow for faster silicon devices for cell phones and other communications devices.

In a statement released yesterday, the company announced that it will offer interested customers a new, fourth, production technology option in which a small admixture of germanium is added to silicon.

According to IBM, “silicon-germanium” technology was invented by the company’s specialists more than ten years ago, and all this time, work was going on to improve it. By adding germanium to silicon in a process known as doping or doping, the speed of the chip can be increased. This boost is especially important for radio devices that operate at high frequencies.

So far, “silicon-germanium” semiconductor devices account for only a small proportion of industrial production (annual sales in this market sector are approximately 1.6 billion. Doll.). The technological process itself is a variation of the generally accepted manufacturing process for the release of CMOS chips. By the way, IBM is constantly working on improving technology and trying to find new approaches to the production of semiconductor devices.

As IBM manufactures semiconductors not only for itself but also for other companies, the statement noted that the new manufacturing process will be immediately available to customers. Two companies were named as the first consumers of the novelty: Sierra Monolithics and Tektronix, engaged in the production of wireless communication devices and electronic measurement and control devices, respectively.

Source: IBM