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Spansion Increases NOR Memory Release, Gradually Goes To ORNAND
Since Spansion (a joint venture between AMD and Fujitsu) and TSMC (Taiwan Semiconductor Manufacturing Company) recently signed an agreement to jointly release NOR flash memory, industry sources report that TSMC is going to increase flash memory production to 20,000 200mm semiconductor wafers and in the future, transfer the production of flash memory to 300-mm production lines.
The increase in NOR flash memory comes amid the ongoing war with the NAND standard, which is rapidly pushing NOR out of the market due to better price / density ratios.
In addition, under the current agreement, TSMC will have to master the production of flash memory using MirrorBit technology in compliance with the 0.11-micron technical process standards – the start of mass production is scheduled for the second quarter of 2021. Spansion’s Taiwanese manufacturing partner will launch chips at its Fab 6 factory in Tainan later this year.
It is worth noting that the number of semiconductor wafers that TSMC will process for Spansion is an estimate – more or less final data from the companies have not yet been received. The second major Taiwanese contract manufacturer, UMC (United Microelectronics Corporation), which was unable to secure the Spansion contract, is still trying to establish contact with the company.
In addition to NOR flash memory made using MirrorBit technology, Spansion is going to launch a 1-Gbps ORNAND chip in the first quarter of 2021 for mobile devices: cell phones and PDAs. ORNAND architecture allows recording two more bits per cell than MirrorBit technology.
Based on materials from iXBT and Digi Times.