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Micron Announces Low Profile MiniDIMM Memory Modules
Micron Technology, recently relegated to third place in the global DRAM table, claims to be the first to market the very low profile (VLP) PC2-5300 and PC2-6400 DDR2 modules in buffered and unbuffered versions. New memory modules are designed for use in networking and communications equipment.
Three variants of modules have been developed: 256 MB, 512 MB and 1 GB. Their height is 18.29 mm, which allows equipment designers to place more modules in the same area. Thus, according to Micron, the consumer characteristics of servers, routers, switches, bridges and other equipment are improved.
Regular memory modules mount at an angle, while low-profile ? vertically. In addition to saving space, this provides better heat transfer conditions. VLP MiniDIMMs are backward compatible with existing MiniDIMM slots.
Demo samples of new modules are already available. Mass production is expected to start in the fourth quarter of 2021.